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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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TTCI Brings Manufacturing Test Expertise to Keysight UGM in Santa Clara

09/03/2026 | TTCI
The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce that it will exhibit at the Keysight Technologies Manufacturing Test User Group Meeting (UGM) on September 16, 2026, in Santa Clara, California.

SMTA Introduces New Academic Institution Membership

08/21/2026 | SMTA
The SMTA is introducing a new Academic Institution Membership designed to strengthen connections between academic institutions and the electronics manufacturing industry while helping prepare the next generation of industry professionals.

Gartner: ANZ LEO D2D Connections to Hit 1.5M by 2027

07/22/2026 | Gartner, Inc.
Low-earth orbit (LEO) direct-to-device (D2D) services in Australia and New Zealand are expected to deliver more than 670,000 connections in 2026, helping close the mobile connectivity gap in rural and regional communities, according to Gartner, Inc., a business and technology insights company.

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.

The Test Connection Earns 2026 PCBAA Outstanding Contributor Award

06/18/2026 | The Test Connection Inc.
The Test Connection, Inc., a provider of electronic test and manufacturing solutions, has been recognized by the Printed Circuit Board Association of America (PCBAA) as a recipient of a 2026 Outstanding Contributor Award.
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