Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
KYZEN's Dr. Mike Bixenman to Conduct Workshop at SMTAI 2017
September 5, 2017 | KyzenEstimated reading time: 1 minute
KYZEN is pleased to announce that Dr. Mike Bixenman will conduct a special workshop during the SMTA International Technical Conference, scheduled to take place September 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, Illinois. The workshop, entitled "Characterization of Soldering Materials, Contaminants, Cleaning Processes and Process Control for Building Reliable Electronic Assemblies," is scheduled to take place September 18, from 1:30-5 p.m.
How clean is clean enough? OEMs struggle with that question when designing electronic hardware. Today, more than 50 percent of components placed onto the board assembly are bottom terminated. The number of connections, component pitch, standoff gap, flux composition and volume of solder reflowed under the bottom termination can impact reliability.
This workshop will look into contaminants derived from the chemical complexity of the PCB including flux residues. We will explore conditions that could be problematic to a no-clean process. Cleaning improves reliability but the complexity surrounding cleaning is far reaching with the use of fine pitch leadless components, the need for longer wash times, high impingement pressure and material compatibility effects. We will explore these complexities and teach cleaning best practices. Once cleaning has been implemented, controlling the process assures repeatability lot to lot. We also will examine methods for controlling the cleaning process including monitoring, traceability and data analytics.
Course Outline:
- Residues on the surface and under components
- Will these residues cause a reliability problem?
- Test methods that can be used to determine the activity of these residues
- Will cleaning improve reliability?
- How clean is clean enough?
- Methods for controlling the cleaning process including monitoring, traceability and data analytics
Dr. Mike Bixenman has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He held the position of IPC/SMTA Cleaning Symposium Chair over the last 10 years and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.