Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
SMART Group Launches Guide to QFN/LGA & BTC Process Defects
September 6, 2017 | SMART GroupEstimated reading time: 1 minute
SMART Group's latest Process Defect Photo Guide, "Guide to QFN/LGA & BTC Process Defects", will be released on October 16. This optical and X-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts. It shows issues at goods receipt, typical assembly-related problems plus solder joint and cleanliness failures that can occur in the field. The guide provides example images of satisfactory print, placement and reflow with many common defects found with optical and X-ray inspection.
Register for the guide here. A download link will be sent on October 16. Simply fill in the form provided to be among the first to receive a copy of the latest Defect Guide.
In addition to this new, free Defect Guide, SMART Group will present a free webinar entitled QFN/LGA & BTC Process Defects – Causes & Cures on Monday 16th October at 2:30 p.m. UK time. The webinar will feature a step-by-step process overview to successfully implementing QFN/LGA & BTC packages as well as the most common failures and corrective action. The guide’s author Bob Willis has had experience in processing these parts in many different soldering process, printing and paste jetting plus conformal coating and successful cleaning processes. To register for the webinar, click here.
Many Defect Guides including Lead-Free have been produced by Bob Willis for the SMART Group and other organisations and magazines. Bob has produced guides/reports on Lead-Free, PCB Surface Finishes, Pin In Hole Reflow, Double-Sided Reflow, PoP Technology, Conformal Coating & PCB Cleaning Failures. Report and guides have also been circulated worldwide by the SMTA to raise money for charity.
For more information about the SMART Group, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.