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SMART Group Launches Guide to QFN/LGA & BTC Process Defects
September 6, 2017 | SMART GroupEstimated reading time: 1 minute
SMART Group's latest Process Defect Photo Guide, "Guide to QFN/LGA & BTC Process Defects", will be released on October 16. This optical and X-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts. It shows issues at goods receipt, typical assembly-related problems plus solder joint and cleanliness failures that can occur in the field. The guide provides example images of satisfactory print, placement and reflow with many common defects found with optical and X-ray inspection.
Register for the guide here. A download link will be sent on October 16. Simply fill in the form provided to be among the first to receive a copy of the latest Defect Guide.
In addition to this new, free Defect Guide, SMART Group will present a free webinar entitled QFN/LGA & BTC Process Defects – Causes & Cures on Monday 16th October at 2:30 p.m. UK time. The webinar will feature a step-by-step process overview to successfully implementing QFN/LGA & BTC packages as well as the most common failures and corrective action. The guide’s author Bob Willis has had experience in processing these parts in many different soldering process, printing and paste jetting plus conformal coating and successful cleaning processes. To register for the webinar, click here.
Many Defect Guides including Lead-Free have been produced by Bob Willis for the SMART Group and other organisations and magazines. Bob has produced guides/reports on Lead-Free, PCB Surface Finishes, Pin In Hole Reflow, Double-Sided Reflow, PoP Technology, Conformal Coating & PCB Cleaning Failures. Report and guides have also been circulated worldwide by the SMTA to raise money for charity.
For more information about the SMART Group, click here.
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