-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
CPSC Hearing Reviews Petition to Ban Organohalogen Flame Retardants in Electronics Casings
September 19, 2017 | IPCEstimated reading time: Less than a minute
On Thursday, September 14, the U.S. Consumer Product Safety Commission (CPSC) held a hearing on petition CPSC-2015-0022; Petition Requesting Rulemaking on Products Containing Organohalogen Flame Retardants. The petition was filed by a group of non-governmental organizations (NGOs) asking the CPSC to ban the use of organohalogen flame retardants in several products, including the (outer) plastic casings of electronics. The petition does not address the use of flame retardants in electronics components.
Rick Goss, Senior Vice President of Environment and Sustainability at the Information Technology Industry Council (ITI) testified at the hearing on behalf of IPC, ITI, and the Consumer Technology Association (CTA). The hearing can be viewed here (the presentation of the joint testimony begins at 2:12).
In joint testimony, the associations requested that the commission follow staff recommendations and deny the petition because it is overly broad and insufficiently justified in its claims, fails to provide the data showing a connection between the exposure to a substance and personal injury or harm from that exposure.
During the hearing, the commissioners posed a number of questions to industry. IPC, CTA and ITA will be working with their members to respond promptly, in advance of the meeting scheduled for September 20.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.