Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Technic Releases TechniFlex LCL1000F/423M
September 20, 2017 | TechnicEstimated reading time: 1 minute
Technic has released the TechniFlex LCL1000F/423M, an extremely durable, direct imaging, fine pitch, matte black solder mask for flexible applications.
TechniFlex LCL 1000F/423M is ideally suited for demanding assembly conditions, including hot-bar soldering or multiple lead-free reflows. Extensive beta site testing of TechniFlex 423M has shown no cracking after multiple 180° bends, even when processing 12-micron polyimide substrate.
TechniFlex LCL 1000F/423M provides exceptionally fine resolution in a matte black product. With less than 10 microns of undercut, TechiFlex LCL1000F/423M consistently provides high resolution on 50-micron solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes. TechniFlex LCL 1000F/423M is available in two versions: U6 for direct imaging/manual exposure and U7 for either direct imaging/manual exposure or roll to roll coating operations.
"Today's cutting-edge flexible circuits require a strong yet flexible material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements. Technic's new TechniFlex LCL 1000F/423M makes processing these advanced flexible PCBs possible," said Tom Horigome, global director of Imaging Products, Technic.
About Technic
Technic is a Rhode Island based corporation with over 900 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.
Learn more here or contact us at (401) 781-6100.
Share on:
Suggested Items
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.