RTW SMTAI: Prototron Continues its Growth

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Thermoreflectance and Solving the Thermal Puzzle in 3D Packaging

06/11/2026 | Marcy LaRont, I-Connect007
Advanced packaging and 3D heterogeneous integration are rapidly redefining the next phase of the semiconductor industry, delivering unprecedented performance gains while posing significant thermal management challenges. In this interview, Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex packages, interposers, and TSV structures.

Rethinking Resilience: How Electronic Component Recovery Is Reshaping the Supply Chain

06/11/2026 | Rob Ronan, Retronix Ltd.
The first article in this series explored how semiconductor shortages exposed the fragility of global supply chains. But shortages are only one part of a broader challenge. The electronics supply chain has always been complex, but in recent years it has become something else entirely: unpredictable. From pandemic-driven disruptions to geopolitical tensions and sudden demand spikes, manufacturers have been forced to confront the hard truth that traditional sourcing strategies are no longer enough.

50 Years of Successful SPEA Testing Solutions

06/10/2026 | Nolan Johnson, SMT007 Magazine
SPEA is celebrating 50 years of test innovation, building on the vision of founder Luciano Bonaria, whose zero-failure philosophy continues to shape the company today. In this interview, Andrea Furnari, vice president of sales and marketing (based in Volpiano, Italy), and Dustin Warren, vice president and regional director (based in Dallas, Texas), reflect on that legacy while pointing to what’s next, from expanding global support to new developments in AI-driven test and high-performance platforms.

Teledyne Space Imaging Sensors Launch Aboard European Space Agency’s SMILE Mission

05/20/2026 | BUSINESS WIRE
Teledyne Space Imaging, a leading supplier of space-qualified imaging sensors, focal plane arrays and integrated camera systems, announced it supplied two CCD370 imaging sensors for the Soft X-ray Imager on the European Space Agency’s SMILE mission (Solar wind Magnetosphere Ionosphere Link Explorer).

When Quality Is Personal: The Human Stakes Behind Electronics Reliability

05/06/2026 | Kelly Dack
In electronics manufacturing, quality is often discussed in terms of specifications, standards, and process controls, but as industry veteran Doug Pauls reminds us, the stakes are far more human. In this conversation, Doug, a recipient of the Global Electronics Association’s Hall of Fame Award, draws on more than four decades of experience to illuminate the real-world consequences of reliability, where even a single defect can carry profound implications. He brings into sharp focus why quality isn’t just a metric, but a responsibility shared by everyone on the manufacturing floor.