Dan’s Biz Bookshelf: ‘iWar: Fortnite, Elon Musk, Spotify, WeChat, and Laying Siege to Apple’s Empire’
Driving Innovation: Size Matters—Navigating the Challenges of XXL PCB Production
It’s Only Common Sense: Reinvention Is a Fundamental Leadership Responsibility
AISMALIBAR to Present FASTHERM at Ford Advanced Lighting Innovation Expo 2017
September 25, 2017 | AismalibarEstimated reading time: 1 minute
Aismalibar is set to introduce their newest product offering, FASTHERM, at the Ford Advanced Lighting Innovation Expo (ALIE) show in Dearborn, MI on October 3-4, 2017.
FASTHERM was developed by AISMALIBAR to achieve a faster thermal transition from the LED thermal pad to the heat sink. This technology allows LEDs to operate at a temperature 30°C to 50°C lower due to the direct thermal transition from the thermal pad to the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper/aluminium base.
Jeff Brandman, President of Aismalibar North America, remarks, “We’re very excited to continue to work with FORD in automotive lighting product development. It is exciting to introduce FASTHERM at such a specialized event and we look forward to presenting our technical capabilities to all stakeholders at the expo.”
ALIE is a unique, ground-breaking opportunity to network with top global OEMS, manufacturers, engineers, buyers and designers directly involved in new and innovative automotive lighting technology.
Aismalibar is a global leader for insulated metal substrates used in the manufacturing of automotive lighting. With strong relationships with many TIER 1 suppliers their products can be found in lighting for many vehicles manufactured around the world and are in current generation Ford, Mercedes, Audi and BMW vehicles among others.
About Aismalibar
AISMALIBAR was one of the first IMS laminate manufacturers in the world and was the first in Europe. AISMALIBAR is proud to introduce their material to the North American market in 2012. Their product IMS Cobritherm ® is a qualified and recognized Insulated Metal Substrate which gives the best thermal management solutions with high thermal conductivity, low thermal impedance and high dielectric capacity. AISMALIBAR has implement a 100% proof test with 1-3KV (High Pot Test) to all IMS laminates coming out of their plant. This is the only way to insure the dialectical strength is perfect and that production problems are detected before PCBs arrive to the end user.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
02/25/2026 | I-Connect007 Editorial TeamThe I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
02/19/2026 | Matt Stevenson -- Column: Connect the DotsThe demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.