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TRI to Feature All-around 3D Inspection at Productronica 2017
October 2, 2017 | TRIEstimated reading time: 1 minute

Test Research, Inc. (TRI) will join Productronica 2017 Trade Fair held at Messe München Exhibition Center in Munich, Germany to showcase its latest 3D automated inspection solutions for PCBA manufacturing. Visit TRI at booth #A2-320 and discuss your quality issues with TRI's experts.
Commenting on this year’s lineup at Productronica, TRI’s VP of Sales and Marketing Jim Lin emphasized: “We are eager to showcase how TRI integrates with automated productions and Industry 4.0 environments."
Presenting an integrated solution for the PCBA production line, TRI will exhibit the Global Technology Award-winning TR7007QI 3D SPI, along with market leading 2D + 3D AOI solution TR7500QE. Both systems deliver industry leading performance based on CoaXPress Imaging Technology. TRI will showcase its hallmark inline PCBA inspection solution, the TR7600 SIII series CT AXI. Built with CT and high density boards in mind allows the TR7600 SIII series models to rapidly deliver very clear 3D X-ray images using high speed cameras with advanced image processing. TRI will also present the latest in line
Discover how TRI’s complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Our experts will demonstrate the advantages of TRI’s Industry 4.0- ready smart inspection software and our high performance hardware design can bring to your production.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
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