SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
Pillarhouse International to Showcase Selective Soldering Systems at productronica 2017
October 2, 2017 | Pillarhouse International LtdEstimated reading time: 1 minute
Pillarhouse International will be exhibiting at the productronica 2017 exhibition, at the Messe Munchen in Munich, Germany from the November 10–13, 2017.
For this year's event, Pillarhouse will be demonstrating its extensive range of selective soldering systems, from their entry-level Pilot through to their premium in-line Orissa Fusion system.
The Pillarhouse Pilot is perfect for small to medium batch hand-load operations wanting a high specification value option. This system is also ideal for SME producers where floor space is at a premium and flexibility and energy saving are key considerations. The Pilot is available with an optional nitrogen generator, which is neatly built into the base of the system.
The Orissa Fusion is a high-speed, in-line, multi-platform selective soldering system. Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
productronica 2017 will see the European launch of the Jade Mk IV, a hand-load selective soldering system with nearly 1,000 units already in the field. The Jade MK IV adds new process features to this industry leading platform, including increased board handing size, enhanced PillarCOMM interface, nozzle conditioning system, and bottom-side instant IR heater.
Pillarhouse will be also exhibiting its new "Wave Enhancement" rework system, a special adapted Synchrodex selective soldering system, in line with a Landrex Optima III SSI. This AOI system has been developed specifically for the through-hole inspection of assemblies as they come out of a Wave solder machine. The AOI passes the inspection information to the Pillarhouse selective machine. The Pillarhouse software then uses this data to repair the failed joints.
Pillarhouse will be in Hall 4 Stand 220.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.