Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Nordson MARCH to Present Paper on Using Plasma Treatment on PCBAs at SMTA Guadalajara
October 4, 2017 | Nordson MARCHEstimated reading time: 1 minute
Nordson MARCH, a Nordson company, will present the paper "Enhancing the Performance of Printed Circuit Board Assemblies Using Plasma Treatment" at SMTA Guadalajara 2017.
David Foote, Global Applications Manager, Nordson MARCH, will discuss the fundamentals of plasma treatment. Specific applications and examples will be shown to demonstrate the many uses and benefits of plasma processing for printed circuit board assemblies (PCBAs), including managing electrostatic discharge (ESD) damage.
"The reliability and performance of modern advanced electronic assemblies must increase to meet market requirements and demands," says Foote. "Plasma treatment is proven to be beneficial for PCBAs as well as for encapsulating the package."
Optimized plasma processes enable 3D-packaging technologies that are useful and reliable. Plasma treatment cleans surfaces prior to bonding to enhance adhesive bonding and wire bonds and enhances the flow of underfill materials for flip chip packages enabling better bonding and more reliable packages. It is beneficial prior to conformal coating for improved adhesion and flow characteristics. Plasma deposition of hydrophobic films onto PCBAs have been shown to improve long-term reliability, and can be an alternative to conformal coatings.
The presentation will be held on Wednesday, October 18, 2017, at 11:30am in Sala A, Hotel RIU Guadalajara, Av. Adolfo López Mateos Sur 830, Fracc. Chapalita, Chapalita, Guadalajara 44500 Mexico.
About Nordson MARCH
Nordson MARCH is the global leader in plasma processing technology for the semiconductor, printed circuit board (PCB), microelectronics, and life science & medical device manufacturing industries. Nordson MARCH has offices and laboratories worldwide, including California, Europe, Singapore, China, Japan, Korea and Taiwan. With over 25 years of continuous innovation, Nordson MARCH designs and manufactures a complete line of award-winning and patented plasma treatment systems. An expert staff of scientists and engineers is available to assist in the development of plasma processes that improve product reliability and increase production yields. Visit Nordson MARCH, click here.
About Nordson Corporation
Nordson Corporation delivers precision technology solutions that help customers succeed worldwide. Precision dispensing of adhesives, coatings, sealants, biomaterials, and other fluids, plastic extrusion and injection molding, electronics testing and inspecting, and surface preparation are supported by applications expertise and direct global support. Nordson serves consumer non-durable, durable and high-technology markets, specializing in packaging, nonwovens, electronics, medical, energy, transportation, construction, and product assembly. Founded in 1954, headquartered in Westlake, Ohio, USA, Nordson has operations and support offices in 30+ countries. Connect with Nordson, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.