Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Ascentech to Show New Optical Inspection System and Ultrasonic Cleaner at SMTA Long Island Expo
October 10, 2017 | AscentechEstimated reading time: 1 minute
Ascentech LLC will exhibit at and participate in the SMTA Long Island Expo & Tech Forum on October 18, 2017 at the Melville Marriott Long Island in New York. At the forum, Ascentech will highlight the Inspectis C12 and the GEN3 Gensonic Ultrasonic stencil cleaner, and will discuss all of the products in the Ascentech product line.
The Inspectis C12 is a plug & play, reliable and cost-effective high definition optical digital inspection system with 12:1 optical zoom, auto focus, integrated illumination, on-board controls and SD-card image capture. The C12 produces crisp images of inspection objects up to 90x magnification directly on an LCD monitor or PC.
The Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.
Ascentech, LLC is the North American Distributor for GEN3 Systems Ltd., offering the MUST Solderability test system (wetting balance), the Auto-SIR2 – Surface Insulation Resistance test system, the CM-Series Ionic Contamination Test system (R.O.S.E.), the Gensonic Ultrasonic stencil cleaner, and DC-Series conformal coating dip-coaters. Ascentech also distributes High Definition and Ultra High Definition inspection cameras from Inspectis Optical Systems AB and High Definition inspection cameras by Optilia Instruments AB. Ascentech personnel will be on hand to field questions regarding all of the abovementioned products and their benefits.
About Ascentech, LLC
Ascentech, LLC is a technology and solutions provider and distributor to the electronics manufacturing and assembly industry with nearly 20 years’ experience. Ascentech is the North American Distributor for Inspectis Optical Systems AB, Optilia Instruments AB, as well as GEN3 Systems, and also supplies the industry with other testing and process optimization solutions for electronics manufacturing. To learn more, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.