-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Ascentech to Show New Optical Inspection System and Ultrasonic Cleaner at SMTA Long Island Expo
October 10, 2017 | AscentechEstimated reading time: 1 minute

Ascentech LLC will exhibit at and participate in the SMTA Long Island Expo & Tech Forum on October 18, 2017 at the Melville Marriott Long Island in New York. At the forum, Ascentech will highlight the Inspectis C12 and the GEN3 Gensonic Ultrasonic stencil cleaner, and will discuss all of the products in the Ascentech product line.
The Inspectis C12 is a plug & play, reliable and cost-effective high definition optical digital inspection system with 12:1 optical zoom, auto focus, integrated illumination, on-board controls and SD-card image capture. The C12 produces crisp images of inspection objects up to 90x magnification directly on an LCD monitor or PC.
The Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.
Ascentech, LLC is the North American Distributor for GEN3 Systems Ltd., offering the MUST Solderability test system (wetting balance), the Auto-SIR2 – Surface Insulation Resistance test system, the CM-Series Ionic Contamination Test system (R.O.S.E.), the Gensonic Ultrasonic stencil cleaner, and DC-Series conformal coating dip-coaters. Ascentech also distributes High Definition and Ultra High Definition inspection cameras from Inspectis Optical Systems AB and High Definition inspection cameras by Optilia Instruments AB. Ascentech personnel will be on hand to field questions regarding all of the abovementioned products and their benefits.
About Ascentech, LLC
Ascentech, LLC is a technology and solutions provider and distributor to the electronics manufacturing and assembly industry with nearly 20 years’ experience. Ascentech is the North American Distributor for Inspectis Optical Systems AB, Optilia Instruments AB, as well as GEN3 Systems, and also supplies the industry with other testing and process optimization solutions for electronics manufacturing. To learn more, click here.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.