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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Nine Dot Connects to Host Free ECAD and MCAD Connectivity Webinar
October 17, 2017 | Nine Dot ConnectsEstimated reading time: Less than a minute
Nine Dot Connects is hosting its latest free webinar “Improving the Altium ECAD / MCAD Connectivity Experience” on Wednesday, October 25, 2017 at 11 am (PT) / 2 pm (ET).
In 2008 Altium revolutionized the way we handle information between the ECAD and MCAD tools. This first generation of tools can be summarized as the passing STEP files to and from the ECAD and MCAD tools. Since then, we have been stuck in this 1st generation of what we call mechatronic collaboration.
Through their partnership with SOLIDWORKS, Altium has brought forth the second generation of mechatronic collaboration. This collaboration not only improves the ability to move data between the MCAD and ECAD worlds, it also removes much of the manually administrative tasks that the first generation of collaboration demands. It goes beyond moving STEP files, and in fact, it does not involve moving STEP files.
Join Nine Dot Connects and learn the differences between the two generations of ECAD and MCAD collaboration, and the benefits that the second generation of collaboration brings to the design process.
Click here to register for this free event now.
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