Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

PCB East 2026: AI Infrastructure, Advanced PCB Technologies, and the Future of Electronics Manufacturing

05/19/2026 | Doug Dixon, 360Circuits
After attending PCB East 2026, it became clear to me that the electronics industry is entering a major transition driven by AI infrastructure, increasing power density, and growing system complexity, extending far beyond semiconductors alone. What stood out was how critical PCB technology, materials science, thermal management, and advanced manufacturing have become to the future of electronics. The industry is now facing many challenges, including tighter manufacturing tolerances, material shortages, rising costs, and growing pressure to digitally transform engineering and manufacturing operations.

Micron Redefines AI Performance With Sampling of 256GB DDR5 Server Module

05/18/2026 | Micron
Micron Technology, Inc. , announced it has sampled 256GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers.

Delta Expands its R&D Capabilities in Soest, Germany with Opening of New R&D Center

05/18/2026 | Delta Electronics
Delta Electronics (Thailand) Public Company Limited, a global leader in power management and smart green solutions, today announced the official opening of its subsidiary, Delta Energy Systems (Germany) GmbH’s new Research and Development (R&D) center in Soest, Germany, significantly expanding its innovation capabilities in high-efficiency power solutions for AI and High-Performance Computing (HPC) data centers, as well as for electric mobility, including 800 VDC server power supplies and 4-in-1 EV power systems.

Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance

05/14/2026 | Chandra Gupta -- Column: Below the Surface
If you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.

Road to Reliability: Engineering High Uptime EV Charging Infrastructure

05/13/2026 | Stanton Rak, SF Rak Company
The transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in