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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Frontline PCB Solutions' InCAM Software Reaches a Record 1,500 Seats
October 25, 2017 | Frontline PCB SolutionsEstimated reading time: 1 minute

Frontline PCB Solutions announced at the TPCA show that its InCAM preproduction CAM solution has achieved a record number of 1,500 seats worldwide. InCAM is now deployed at over 330 sites — over 60 relying exclusively on InCAM — and has thousands of certified operators using InCAM software to produce the majority of advanced designs powering mobile devices today.
“InCAM delivers tangible benefits which explain its success,” said Yovav Sameah, president, Frontline. “Most of the world’s advanced fabricators already rely on InCAM’s high-precision CAM tooling and advanced data integrity for robust production across all PCB industry segments. The launch of InCAM Flex in 2016 significantly expanded InCAM’s capabilities and penetration, and Frontline’s partnership with Mentor ensures compliance with the ODB++ data format. Frontline has pioneered innovative CAM solutions for over twenty years and remains focused on meeting the challenges of this fast-moving industry. “
About InCAM
InCAM is a comprehensive CAM system deployed at the majority of the world’s advanced fabricators, powering PCB production across all PCB industry segments – from simple to complex MLBs through HDI, IC substrates, rigid-flex and flex PCB manufacturers. Fully ODB++ compliant, InCAM supports the latest versions of the PCB industry’s standard data format. InCAM combines editing and analysis with automatic design-for-manufacture optimization to perform fast high-precision CAM tooling – helping manufacturers achieve lasting profitability and a competitive edge. InCAM expands yield growth by enabling operators to multi-task and run processes in the background using the computer's multi-core CPU capabilities. Cycle time is shortened as colleagues collaborate on jobs in a data-secure environment. InCAM delivers advanced data integrity and fault indication by allowing interactive post processing on selected DFM results. InCAM operators enjoy a streamlined user interface and easy-to-use tools. In addition, backwards compatibility with Genesis 2000, for both data and automation, drives productivity even further.
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device is produced using Orbotech technology. For more information click here.
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Rachael Temple - AlltematedSuggested Items
Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
07/31/2025 | Global Electronics AssociationThe Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
From Attraction to Action: Where Marketing Ends and Sales Begins
07/29/2025 | Brittany Martin, I-Connect007Before a PO hits the system, marketing has already done a lot of heavy lifting. Without strategic marketing, the PO might never arrive. At I-Connect007, we have been fortunate to help many companies achieve sales success through marketing. The key to success? Understanding how marketing leads to sales.
American Made Advocacy: A Growing Presence in Washington in Turbulent Times
07/29/2025 | Shane Whiteside -- Column: American Made AdvocacyLast month, PCBAA held its fourth annual meeting in Washington, D.C. It was our largest gathering to date and included speakers from the House and Senate, the Department of Commerce, and OEMs Lockheed Martin, RTX, and Northrop Grumman. We also spent a day on Capitol Hill educating lawmakers and their staff about the importance of a secure domestic microelectronics supply chain.