-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Alpha's Rahul Raut to Speak on Opportunities for Graphene in the Electronics Industry at IDTechEx Show
October 26, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes

Alpha Assembly Solutions is participating in the IDTechEx Show taking place on November 15–16 in Santa Clara, California. Alpha will be exhibiting jointly with MacDermid Performance Solutions at Booth I15.
Rahul Raut, Director of Strategy & Technology Acquisition for Alpha, was invited as a guest speaker to present on opportunities for graphene in the electronics industry. His presentation will discuss the major opportunities and challenges for graphene-based products in real-world applications and then highlight methods that have been developed through collaboration with the National Graphene Institute (NGI) at the University of Manchester that will help overcome these challenges.
"Currently, one major challenge is the ability to produce high quality graphene engineered or tailored for specific applications, in a scalable high-volume manufacturing (HVM) method," said Rahul Raut. "Alpha's work with NGI has led to the development of a HVM capable synthesis method that engineers large size graphene flakes which, when made from this process, possess a unique combination of properties that make them suitable for use in electronic materials and other related applications."
Alpha's exhibit will include the ALPHA Graphene Portfolio consisting of inks, pastes and foils, in addition to ALPHA Products for Flexible, Formable and Printed Electronics, such as Silver, Carbon and Dielectric inks and Low-temperature solder pastes.
About IDTechEx
Since 1999 IDTechEx has provided independent market research, business intelligence and events on emerging technology to clients in over 80 countries. They provide clients with insights to help make strategic business decisions and grow their organisations. IDTechEx is headquartered in Cambridge, UK with additional offices in USA, Germany and Japan and associates in South Korea.
About MacDermid Performance Solutions
MacDermid Performance Solutions Business group of businesses supply innovative, functional products to a rapidly changing electronics marketplace. We research, develop and deliver specialty substrates and high performance environmental friendly materials that enable the manufacture of complex electronic circuits and assemblies.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive, flexible & printed electroncis and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.