-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Balver Zinn Group at productronica 2017
October 26, 2017 | Balver Zinn GroupEstimated reading time: 1 minute
The Balver Zinn Group announces that they will be attending Productronica scheduled to take place November 14-17 in Munich, Germany. The Balver Zinn Group will highlight the company’s latest solder technology and services in hall 4, booth #261.
As the licensee we present Nihon Superiors newly patented SN100CV lead-free micro-alloyed solder. The industry standard SN100C has been proven as the one of the best Silver-free Lead-free solder. Now Nihon Superior has developed remarkable new lead-free solder alloy by the addition of bismuth which has positive effects on the reliability of the solder joints. The SN100CV alloy offers high reliable solder joints for a lower price compared to Ag-containing alloys.
SN100CV has all the advantages that have made SN100C so popular, including reduced copper dissolution rates. The lower surface tension of the solder and less surface oxidation related to the germanium, will provide better wetting and flow properties.
Balver Zinn has over 13 years of experience in manufacturing SN100C and can rely on an extensive global partner network. In 2013 Balver Zinn has been granted the right to sub-license the SN100C patent by Nihon Superior Co. Ltd.
During the Productronica show Keith Sweatman from Nihon Superior Co. Ltd. will be present at the Balver Zinn booth to provide support whenever special attention is needed to optimize the SN100C processes. Keith Sweatman is graduate in metallurgical engineering and since 2001 he has been assisting Nihon Superior Co, Ltd. and development of their global business in lead-free solders.
Also at the Productronica show will be Cobar OT2M and BSA04-XSP solder paste along with B2012 solder wire and the extensive range of Cobar solder fluxes.
About the Balver Zinn Group
Headquartered in Germany, the Balver Zinn Group has facilities in the United States, Europe and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste and miscellaneous service and soldering products. For information about the company’s complete range of solder materials, visit www.balverzinn.com or www.cobar.com.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.