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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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EIPC to Exhibit at productronica 2017
October 30, 2017 | EIPCEstimated reading time: Less than a minute
The European Institute for the PCB Community (EIPC) will be exhibiting at the upcoming productronica 2017 event, to be held November 14–17, in Munich, Germany. EIPC will be at Hall B3 Stand 529.
At the event, EIPC will highlight its upcoming activities and initiatives, including its 50-year Anniversary Event, as well as the Winter 2018: EIPC Winter Conference in Lyon.
Visitors will also be able to speak with the following EIPC members who will be present at booth during the event:
- Custer Consulting Group
- European Circuits Ltd
- FED, Fachverband Elektronik-Design e.V.
- Kubatronik Leiterplatten GmbH
- Osborn International GmbH
- Technic Electric Ltd
- Totking Technology Co. Ltd
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