-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Soldering Tip: Key to Good Solder Joints
October 31, 2017 | Stephen Las Marias, I-Connect007Estimated reading time: 3 minutes
For more than 85 years, JBC Soldering has been providing soldering and rework tools for the electronics manufacturing industry. Headquartered in Barcelona, Spain, the company also has branches in St. Louis, Missouri, in the USA; Guadalajara, Mexico; Hong Kong; and Shanghai, China.
In an interview with SMT Magazine at the recent NEPCON South China event in Shenzhen, Enrique Moreno, technical support engineer, discusses the key parameters to consider during hand soldering to achieve the perfect solder joint.
Stephen Las Marias: Solder joint defects are among the key problems in PCB assembly. Why do you think so?
Enrique Moreno: Mainly, the problem with hand soldering on PCBs comes with the bigger planes, and most especially with barrel filling. Good thermal transfer is important to make a good solder joint. Maybe this can be solved with high temperature on the tip, but then the intermetallic formation of the solder joint can be too big. You can have problems on the mechanical strength of the solder joint. Later, it may crack, leading to product defects.
Las Marias: What are the parameters to consider to make those perfect solder joints?
Moreno: The most important is temperature. If it is too high, the pads will burn; while too low a temperature and the tin will not melt. But also important is how this thermal transfer is done to the PCB. For this, JBC has special tips that allow users to fill those barrels easily. We also have special preheaters that can help them if they need an extra heating system while they are soldering. Users don’t need to reach a soldering temperature to 400°C to avoid this huge intermetallic part; they can control the temperature to avoid problems on the PCB.
Good tools are needed. You need a system with good soldering tips, where energy is reactive, not cumulative—imagine a big soldering tip with plenty of heat inside. Temperature and tips change. Regarding thermal transfer, the more heat that can reach the component and pin parts, the faster and easier soldering is for the operator. Also, very critical is the use of the appropriate flux because it takes oxidation off the pins and the pads.
Las Marias: What is the proper temperature to achieve good intermetallic formation?
Moreno: Good intermetallic connection needs to be achieved. The problem is that when it’s really high temperature, the intermetallic bonds increases. If you go with lower temperature, the soldering tip’s life is longer. Soldering can be done in several different temperatures, so as low a temperature you can select, will help the tip last longer. At the end, of course, it is not that big a difference between 320°C and 350°C in terms of soldering. But the tip life will last longer with 320°C than in 350°C. In this way, we recommend going as low a soldering temperature as you can. Sometimes, we know that operators are under pressure from production, so they increase the temperature to do soldering faster, but the quality and reliability will be compromised. Operators should be trained properly, and they need to be trained in soldering.
Las Marias: After hand soldering, is visual checking enough to know whether the solder joint is good or not?
Moreno: Visual checking is not enough. You cannot see whether intermetallic bonds are being formed just by looking at the solder joint. For example, if you do barrel fill, you need extra equipment such as X-ray inspection machines, where you can see if the barrels are filled or not. Sometimes you could see the top and the bottom of the solder joint, but inside, it is not a good joint.
Las Marias: What can you say about the move towards automated/robotic soldering? Do you see this trend becoming more popular in the future?
Moreno: We are quite sure that automation and robotics will increase. In line with this, JBC just developed new soldering tools for automation including a soldering head, new cartridges, features automatic tip changing, tip cleaning, and automatic fillers—all of them Industry 4.0-enabled.
Las Marias: Who will achieve the perfect solder joint: a robotic soldering system or a highly skilled operator?
Moreno: First, someone needs to tell the robot how to do it. If you don’t know how to program this robot to make the perfect solder joint, you are lost. Robots are quite good for repetitive tasks, like in a production environment. But good operators with really good skills can also work in rework environments, where several different tasks need to be done. He can choose the appropriate temperature, appropriate tools, just by looking at the PCB.
Las Marias: Thank you very much, Enrique.
Moreno: Thank you.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.