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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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PADS Webinar: Library Management Doesn’t Have to be Difficult
October 31, 2017 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Creating library content can be simple with the right tools. CAD vendors can only supply so much content. At some point, you have to create a symbol or footprint. Don’t use the manual processes provided. This one-hour webinar will show you how to use automation tools included with PADS to create the parts you need quickly and simply.
Finding those parts to place on a design can be tedious. You’ll learn how to simplify this process using parametric searching.
The webinar will take place on November 9, 2017, at 9:30 am Pacific. The presenter is Brent Klingforth,
Attendees will learn:
- Tool automation to help make custom symbols
- Wizard based footprint creation using IPC compliant rules
- Manage component property information the easy way
- Library content and data available for free
To register, or for more information, click here.
Suggested Items
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
New IPC VP Joe Schneider Building Stronger Focus on U.S., Canada
06/19/2025 | Marcy LaRont, I-Connect007IPC has hired Joe Schneider as a vice president to strengthen its regional focus and address the specific needs in the U.S. and Canada. Joe brings a rich background in OEM and contract manufacturing, including with industry giants like Siemens and Abbott Laboratories. In this interview, he shares his vision for the region, which emphasizes workforce development and supply chain challenges.