SMT Perspectives and Prospects: The AI Era, Part 3: LLMs, SLMs, and Foundation Models
Punching Out: What Buyers Are Buying
‘Deepfake’ ComponentsTopLine CCGA, PID Vibration Damping Technology to Highlight Exhibit at productronica
October 31, 2017 | TopLineEstimated reading time: 1 minute
TopLine’s CCGA Column Grid Array IC packages and new Particle Impact Dampers (PID) that reduce random vibration will highlight the company’s exhibit at productronica 2017. TopLine will exhibit in Hall A4 Booth 504, where a PID informational video and demonstration will be held continuously in the booth over the 4-day show.
In making the announcement, Martin Hart, President, stated, “We’re reaching out especially to international customers at the show to introduce them to these enabling technologies. In fact, we’ve been continuously active in promoting our products in the global market for 28 years. We’re especially excited about the benefits of CCGAs, as well as new PID technology that reduces harmful vibrations and extends hardware life and reliability.”
TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs), and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.
PID is a COTS commercially-available standard solution, suitable for retrofitting and hardening heritage hardware in the field. PIDs can be solder attached like ordinary components, or attached to the board using permanent epoxy adhesive. TopLine’s new series of Particle Impact Dampers were invented at NASA’s Marshall Space Flight Center.
For more information and to see a demonstration, visit Hall A4 Booth 504 at productronica; those interested are also encouraged to visit a new web site showing a 2-minute YouTube video showing how the PID works; Please click here.
About TopLine
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
Share on:
Suggested Items
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
The SD11 Inkjet Printer and Ventec Giga Solutions
10/10/2024 | Marcy LaRont, PCB007 MagazineVentec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.
SolderKing Celebrates a Milestone of Growth and Innovation in Soldering Solutions
10/10/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, is celebrating six years of growth and success in the electronics and industrial manufacturing sectors.
ViTrox Showcases Revolutionary SMT Inspection Solutions at SMTA International 2024
10/08/2024 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is pleased to announce our participation in SMTA International (SMTAi) at Donald E. Stephens Convention Center, Booth #2111 and #2730 from 22 to 24 October 2024.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.