-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Creating the Perfect Solder Joint
November 3, 2017 | Stephen Las Marias, I-Connect007Estimated reading time: 2 minutes

What are the characteristics of a good solder joint? Generally, from a visual standpoint, they should be smooth, bright, shiny, clean, and have a nice concave solder fillet. At least, these characteristics describe solder joints for through-hole components. What about for surface-mount devices? Or bottom terminated components? Moreover, how do you ensure that inside those joints, good intermetallic bonds are formed?
Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint, according to Rick Short of Indium Corp., during my interview with him at the recent NEPCON South China trade exhibition in Shenzhen, China.
Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. For example, there are solder joints that are necessary for physical strengths, such as holding components, like connectors. We often wiggle and yank our phone jacks—there’s a little bit of solder trying to hold all that together, and we keep doing it over the course of ownership of the device. So, those joints must be very robust with regard to physical strength. Other solder joints are merely there to conduct electricity. They don’t have much of a harsh life at all, and it is a relatively easy life for them. Other solder joints, meanwhile, are involved in very high heat dissipation demands. They must conduct electricity and heat, and they might also need to address physical strength issues. So, many different opportunities exist for solder joints to either cause you problems or contribute to the success of your finished goods.
Nobody, including myself, wants field failure. I often travel overseas for work, so I definitely don’t want the airplane I’m on to experience that "field failure." But going back to our topic on solder joints, I vividly recall that fatal plane crash a few years ago that was mainly caused by cracked solder joints in the subassembly unit that controls the rudder. The crash was tragic, but the cause of it is also the reality. I am not sure about the other technical details on the plane, but it had already logged 23,039 flight hours since its manufacture, and 13,610 cycles (an aircraft cycle means takeoff and landing).
Just imagine the many hours that these PCB assemblies have been subjected to harsh conditions—component breakdowns are inevitable. Which is why the reliability of PCB assemblies remains very critical.
In our recent survey on soldering, we identified many challenges to address during the soldering process to ensure good solder joints. These include solder paste selection, thermal issues and reflow profiles, voiding, and component size variations, to name a few.
To read the full version of this article, which appeared in the October 2017 issue of SMT Magazine, click here.
Suggested Items
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.