Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Goepel electronic's New Detector for Flexible Automated X-ray Inspection
November 6, 2017 | GOEPEL ElectronicEstimated reading time: 1 minute
Goepel electronic's StingRay Detector is the name of the new image acquisition concept for fully automatic X-ray inspection of single-sided and double-sided PCBs. It enables selective 2D, 2.5D and 3D X-ray inspection with high image quality at highest speed. The StingRay Detector is another option for the inline AXI systems of the X Line · 3D family.
The new technology ensures even better layer separation and brilliant, high-resolution images, especially on 3D images of selected areas. The detector concept consisting of a high-speed X/Y axis and a flat-panel detector keeps the balance between image quality and cycle time. The focus is on the reliable inspection of challenging solder joints such as BGAs, QFNs and LGAs. By a scalable number of acquired projections, a high quality of the layer separation is achieved. The 3D reconstruction of the images is done by the planar CT.
The StingRay Detector can be configured according to the inspection task. For example, a total of three detector sizes with a resolution of 1.3 to 6 megapixels are available. In addition to the stepless height adjustment of the X-ray source, the detector distance to the module can also be varied in three steps. This results in different image field sizes and resolutions depending on the specific requirements.
The StingRay Detector addresses users with a test strategy that requires reliable inspection of individual assembly areas at top speed. In contrast to this, the MultiAngle Detector for the X Line · 3D family realizes a full-surface X-ray inspection of all solder joints on the entire board with a scanning image acquisition.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.