-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Technology Adds Value to Pre-reflow with Panasonic NPM Mounter APC System
November 7, 2017 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology's Zenith 3D AOI System is fully connected to Panasonic NPM (Next Production Modular) and Mounter APC (Advanced Process Control) Systems. The Zenith 3D AOI System is the first certified APC-ready 3D AOI for 0201M components, which can improve yields in high density placements.
The Koh Young Zenith 3D AOI is able to feed correct mounting position values (X, Y, Theta) to Panasonic NPM mounters ensuring that components are mounted in the targeted position as intended. This feature, also known as APC-MFB (Advanced Process Control-Mounter Feedback), improves process repeatability by automatically adjusting component placement to the paste, rather than to the pad location. Moreover, APC-MFB will catch the shift trend and conduct further position correction by using true 3D measurement data from the Zenith AOI system.
To achieve this M2M feedback control system, Koh Young has undergone rigorous verification with 10µm and 15µm Zenith 3D AOI systems. Upon successful completion of testing, Koh Young has been certified for 0201M components in addition to 0402M components; making them a leading solution provider for microchip mounting reliability.
Commenting on their successful partnership with Panasonic Smart Factory Solutions Co. Ltd, Nobuo Kobayashi, Managing Director of Japan Koh Young Co. Ltd, said, "We are honored to join the trusted APC Alliance as our vision is to deliver Agile Manufacturing innovation to our customers. We believe our superior feedback capability of the APC-ready Zenith will deliver quality pre-reflow yield and develop minimum industry standards for narrow pitch placement of microcomponents."
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers.
Suggested Items
China Overtakes Germany and Japan in Robot Density
11/22/2024 | IFRChina's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.