-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young and ASM Assembly Systems Working with KSMART Partners Toward Zero-Defect Line
November 8, 2017 | Koh Young TechnologyEstimated reading time: 3 minutes
Koh Young Technology is collaborating with its KSMART partners like ASM Assembly Systems to realize machine connectivity and create a zero-defect production line. Koh Young will demonstrate the latest connectivity solutions for optimizing printers at productronica in Munich, Germany during November 14-17.
Automated Printer Optimization
Rising demand for smaller, lighter, and smarter electronic devices has led to an increasing use of ultra-fine pitch packages, such as flip chips and chip scale packages in printed circuit board assembly (PCBA). These shrinking packages force smaller aperture designs and finer solder paste, which have made stencil printing a highly-sophisticated process with a tremendous impact on production yields. In fact, 70 percent of all PCB assembly defects are primarily due to problems directly associated with the solder printing process. Therefore, manufacturers must ensure the optimal printing paraments are consistently applied during production.
Growth Trajectory towards a True Connectivity
Defining the correct process parameters often requires a high degree of expertise, because of the various environmental considerations affecting the process. Using Machine-to-Machine (M2M) connectivity, Koh Young Technology and its KSMART printer and mounter partners can overcome the challenges.
KSMART Process Optimizer
The KSMART Process Optimizer (KPO) is a key deliverable from the collaborative projects with partner companies like ASM Assembly Systems, ASYS Systems, Speedline, Panasonic Factory Solutions, and others. Powered by its Intelligent Platform (IP) for adaptive learning, KPO has evolved far beyond its roots as a simple closed-loop option that continuously monitors and adjusts processes to maintain a target value.
The enhanced KPO solution, comprised of three interlinking software modules, actively optimizes the printing process by combining real-time printing information with SPI measurement data. Print Advisor Module (PAM) automatically performs DOEs designed to perform a detailed SPI result analysis using advanced diagnostic algorithms and noise filtering models, and then recommends the ideal print parameters. Printer Diagnostic Module (PDM), the second module, uses multiple anomaly-detection algorithms to actively optimize the print process and further reduce false calls. The final module, called POM (Printer Optimizer Module), uses the Koh Young adaptive learning engine to generate models and fine-tune process parameters. While each module provides inherent standalone process benefits, the combined power of KPO and the three modules ensures the highest process reliability and production flexibility without dedicated resources and expertise.
M2M Connectivity
Koh Young is also working with mounter partners to achieve complete line communication and further enhance the value of its true 3D inspection solutions. With the help from its KSMART partners, Koh Young has leveraged the power of true machine connectivity. Its M2M Connectivity solution optimizes the process by exchanging real-time measurement data between SPI and AOI systems, as well as printers and mounters. Koh Young systems feed offset and warning data to other systems, while analyzing trends for process optimization and traceability. Combining the new modules provides unsurpassed performance power. For example, Link@KSMART, which connects all the inspection systems within a line gains further benefits when combined with M2M@KSMART. Together with our partners, we are working to optimize the SMT line and achieve a zero-defect future.
“Networked intelligent systems that allow real-time results to be correlated, calculated, and visualized will become even more essential in the Smart Factory,” said Eric Jeon, Director of R&D at Koh Young Technology. “By working with our KSMART partners, we can add value to our SPI and AOI users. As part of this partnership, we look forward to continuously pushing the boundaries of the technology,” concluded Mr. Jeon.
As the absolute leader in the SPI and AOI markets, Koh Young will display a broad sampling of its latest developments, as well as participate in several show activities, including topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at booth 377 in hall A2.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers. For more information, click here.
Suggested Items
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.