-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young and ASM Assembly Systems Working with KSMART Partners Toward Zero-Defect Line
November 8, 2017 | Koh Young TechnologyEstimated reading time: 3 minutes
Koh Young Technology is collaborating with its KSMART partners like ASM Assembly Systems to realize machine connectivity and create a zero-defect production line. Koh Young will demonstrate the latest connectivity solutions for optimizing printers at productronica in Munich, Germany during November 14-17.
Automated Printer Optimization
Rising demand for smaller, lighter, and smarter electronic devices has led to an increasing use of ultra-fine pitch packages, such as flip chips and chip scale packages in printed circuit board assembly (PCBA). These shrinking packages force smaller aperture designs and finer solder paste, which have made stencil printing a highly-sophisticated process with a tremendous impact on production yields. In fact, 70 percent of all PCB assembly defects are primarily due to problems directly associated with the solder printing process. Therefore, manufacturers must ensure the optimal printing paraments are consistently applied during production.
Growth Trajectory towards a True Connectivity
Defining the correct process parameters often requires a high degree of expertise, because of the various environmental considerations affecting the process. Using Machine-to-Machine (M2M) connectivity, Koh Young Technology and its KSMART printer and mounter partners can overcome the challenges.
KSMART Process Optimizer
The KSMART Process Optimizer (KPO) is a key deliverable from the collaborative projects with partner companies like ASM Assembly Systems, ASYS Systems, Speedline, Panasonic Factory Solutions, and others. Powered by its Intelligent Platform (IP) for adaptive learning, KPO has evolved far beyond its roots as a simple closed-loop option that continuously monitors and adjusts processes to maintain a target value.
The enhanced KPO solution, comprised of three interlinking software modules, actively optimizes the printing process by combining real-time printing information with SPI measurement data. Print Advisor Module (PAM) automatically performs DOEs designed to perform a detailed SPI result analysis using advanced diagnostic algorithms and noise filtering models, and then recommends the ideal print parameters. Printer Diagnostic Module (PDM), the second module, uses multiple anomaly-detection algorithms to actively optimize the print process and further reduce false calls. The final module, called POM (Printer Optimizer Module), uses the Koh Young adaptive learning engine to generate models and fine-tune process parameters. While each module provides inherent standalone process benefits, the combined power of KPO and the three modules ensures the highest process reliability and production flexibility without dedicated resources and expertise.
M2M Connectivity
Koh Young is also working with mounter partners to achieve complete line communication and further enhance the value of its true 3D inspection solutions. With the help from its KSMART partners, Koh Young has leveraged the power of true machine connectivity. Its M2M Connectivity solution optimizes the process by exchanging real-time measurement data between SPI and AOI systems, as well as printers and mounters. Koh Young systems feed offset and warning data to other systems, while analyzing trends for process optimization and traceability. Combining the new modules provides unsurpassed performance power. For example, Link@KSMART, which connects all the inspection systems within a line gains further benefits when combined with M2M@KSMART. Together with our partners, we are working to optimize the SMT line and achieve a zero-defect future.
“Networked intelligent systems that allow real-time results to be correlated, calculated, and visualized will become even more essential in the Smart Factory,” said Eric Jeon, Director of R&D at Koh Young Technology. “By working with our KSMART partners, we can add value to our SPI and AOI users. As part of this partnership, we look forward to continuously pushing the boundaries of the technology,” concluded Mr. Jeon.
As the absolute leader in the SPI and AOI markets, Koh Young will display a broad sampling of its latest developments, as well as participate in several show activities, including topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at booth 377 in hall A2.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers. For more information, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).