-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Zestron to Raffle VIGON RC 303 at SMTA New England Expo
November 13, 2017 | ZESTRONEstimated reading time: 1 minute

Zestron will feature its oven cleaning maintenance product, VIGON RC 303, at the SMTA New England Expo on November 16, 2017. Additionally, the company will raffle a sample of VIGON RC 303 cleaning agent, complete with its newly developed pressure sprayer, during the expo.
"We are excited to offer an oven cleaning maintenance product that in combination with our pressure sprayer, makes oven cleaning fast and efficient," said Sal Sparacino, sales and marketing manager, Zestron.
VIGON RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. It also removes re-condensed fluxes and emissions from condensation traps and heat exchangers.
The Pressure Sprayer is developed for spraying large surfaces within seconds. The refillable pressure sprayer is the ideal solution for cleaning reflow ovens and wave solder systems as well as for the manual cleaning of oven parts, such as condensations traps or solder frames.
Winners will be drawn from Zestron's booth at the conclusion of the event. The SMTA New England Expo and Tech Forum will be held at the DCU Center on November 16. For more information or to register, please visit smta.org.
About ZESTRON
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing and semiconductor industries. With seven worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.