Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Datest to Exhibit at SMTA Silicon Valley Expo & Tech Forum
November 14, 2017 | DatestEstimated reading time: 2 minutes
Datest today announced plans to exhibit at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Wednesday, Nov. 29, 2017 at Bestronics, Inc. in San Jose, California. The event is free to attend and includes a complimentary lunch. For more information or to register for the event, click here.
Robert Boguski, Regina Lathrop and other Datest personnel will give attendees a preview of the company’s latest equipment acquisition – a 225kV custom-made VJ Technologies advanced digital radiographic inspection imaging system, which was delivered Nov. 7th. This system will provide Datest with a reliable high precision Micro Focus X-ray inspection platform for numerous failure analysis, materials science, metrology and inspection applications. High-level assistance in the form of Ph.D.-level radiographic and ASNT Level III technicians also will be available on a project-by-project basis. The system is in the process of being assembled and prepared for operation by Datest and VJT personnel, and will go live at the end of 2017.
Additionally, they will discuss the company’s testing, engineering and PCB reverse engineering services, and value-added services including:
- Bonepile Rehabilitation Services
- 3D and CT-Scan X-ray/Failure Analysis Service
- Improved and enhanced flying probe test services
- Improved and enhanced in-circuit testing services
An ISO9001- and AS9100-certified company, Datest offers extensive lab services, including XRF, SEM-EDX, Dye & Pry, cross-sectioning and C-SAM. The company offers in-circuit testing (ICT) and test development (hardware and software) for all major ICT platforms (Agilent 3070, GenRad, and Teradyne).
Datest augments ICT with SPEA Flying Probe testing, Agilent 5DX and Nordson DAGE Ruby 2D X-ray with X-Plane Technology, benchtop boundary scan and functional testing. Datest also offers a wide ecosystem of partner companies providing complimentary laboratory, test and failure analysis services.
About Datest
Datest is the preeminent provider of advanced, efficient, and cost-effective PCBA testing, test engineering, failure analysis and analytical solutions. Established in 1984, Datest now offers in-circuit and flying probe testing and development services; DFT/DFM analysis; JTAG/Boundary Scan development services; AXI as well as 2D and 3D X-ray and CT-scan capabilities for nondestructive failure analysis, root cause identification, and dispute resolution. The company also offers cross-sectioning, dye & pry, and analytical laboratory services, including SEM and C-SAM analysis; counterfeit component identification and detection; and reverse engineering services. Datest is ITAR registered and has a quality management system (QMS) that is certified to ISO9001 and AS9100C. For more information, call 510-490-4600 or click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.