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Kurtz Ersa Enables Big Board Rework
November 15, 2017 | Kurtz Ersa Corp.Estimated reading time: 1 minute
Kurtz Ersa has launched an automated rework platform for large and heavy PCBs. Providing a heatable area of 625 x 625 mm and the capability to handle board thicknesses of up to 10 mm, the HR 600 XL hybrid rework system offers for the first time a professional repair of high-channel components on big boards, as they occur in telecommunications, networks and infrastructure.
The lower IR Matrix Heater consists of 25 heating elements that can be controlled individually and has a total power of 15 kW. In this way, it is possible to obtain an ideal heat distribution on every application during the preheating process.
The highly efficient 800 W hybrid heating head manages the desoldering and soldering of the smallest components to large ball grid arrays measuring up to 60 x 60 mm, in the familiar Ersa quality and reliability. Just like its smaller brother HR 600/2, the HR 600 XL incorporates an automatic and precise component alignment (±0.025 mm). The process control and documentation with the HRSoft 2 user guidance guarantees reproducible repair results.
The HR 600 XL can be used in fully automatic or half-automatic mode to ensure maximum flexibility. It is compatible with the usage of the Ersa Dip&Print station for the preparation of the components with flux or solder paste before soldering.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.