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Video from productronica 2017: Nordson ASYMTEK Highlights Bulk Dispensing Technology
November 16, 2017 | I-Connect007Estimated reading time: Less than a minute

Nordson ASYMTEK is known for microdispensing. At this week’s productronica, one of the highlights from the company is the new Helios SD960 bulk and two-component dispensing system. Almar Thewissen, program manager for Industrial Applications, EMEA, at Nordson, discusses its applications with I-Connect007 Technical Editor Pete Starkey.
Watch The Interview Here:
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Brent Fischthal - Koh YoungSuggested Items
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
07/31/2025 | Nordson CorporationNordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.
Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
07/28/2025 | Technica USATechnica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.