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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Qnity Showcases Materials Innovations Powering the Next Leap in Electronics at TPCA Show 2026

10/05/2026 | Qnity 
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, will showcase its portfolio at TPCA Show on Oct. 20–22 at the Taipei Nangang Exhibition Center.

EMD Electronics Opens Wisconsin R&D Facility for Semiconductor Materials

10/02/2026 | Globe Newswire
EMD Electronics, the North America electronics business of Merck KGaA, Darmstadt, Germany, announced the opening of a new 38,000-square-foot research and development facility at its Sheboygan Falls, Wisconsin site, expanding the company’s ability to develop and scale advanced materials for next-generation semiconductor manufacturing.

HBM, Advanced Packaging and Cooling Market Set for Growth Through 2037

09/30/2026 | Globe Newswire
High-bandwidth memory (HBM) and advanced packaging materials are becoming critical components of the artificial intelligence semiconductor supply chain.

Indium Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium

09/28/2026 | Indium Corporation
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power performance challenges at the IMAPS Symposium 2026, September 29-October 1, in Boston, Massachusetts.

ACCM Expands US Manufacturing Capacity for AI Infrastructure

09/28/2026 | BUSINESS WIRE
Advanced Chip and Circuit Materials, Inc. (ACCM) announced a major expansion of its US manufacturing capacity for the Celeritas® family of advanced dielectric materials, covering the four segments of AI hardware where material supply and performance currently constrain system design: ultra-high-speed skew-free materials, low- and negative-expansion laminates for large accelerator boards, IC substrate/package core materials, and build-up materials.
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