-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Mycronic and Aegis Renew Partnership, FactoryLogix to be Embedded with MY700
November 17, 2017 | Mycronic ABEstimated reading time: Less than a minute
Through a renewed partnership agreement, Mycronic will include Aegis Software's FactoryLogix NPI as the main programming interface for its MY700 Jet Printer and Jet Dispenser. The tailor-made software, branded as FactoryLogix Express, will also have the capability to prepare data for Mycronic's range of pick-and-place machines, through an optional TPSys output interface.
"The MY700 is the industry's fastest jet dispensing platform, capable of shooting a vast range of media including solder paste at speeds up to 300 dots per second. Aegis' powerful FactoryLogix software provides the type of versatile and field-proven NPI capability that makes the MY700 an unbeatable solution for both high-mix and high-speed dispensing applications," says Clemens Jargon, VP Global Dispensing.
"We are extremely proud to be part of Mycronic's unique offering," says Jason Spera, CEO of Aegis Software. "Mycronic and Aegis have a long history of cooperation, going back more than 15 years. It’s with great pleasure we now see this cooperation continued and strengthened for the benefit of our mutual customers."
As part of the agreement, Mycronic will provide an upgrade path for earlier generation machines, enabling MY500 and MY600 users to also benefit from the renewed partnership.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.