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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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Mycronic and Aegis Renew Partnership, FactoryLogix to be Embedded with MY700
November 17, 2017 | Mycronic ABEstimated reading time: Less than a minute
Through a renewed partnership agreement, Mycronic will include Aegis Software's FactoryLogix NPI as the main programming interface for its MY700 Jet Printer and Jet Dispenser. The tailor-made software, branded as FactoryLogix Express, will also have the capability to prepare data for Mycronic's range of pick-and-place machines, through an optional TPSys output interface.
"The MY700 is the industry's fastest jet dispensing platform, capable of shooting a vast range of media including solder paste at speeds up to 300 dots per second. Aegis' powerful FactoryLogix software provides the type of versatile and field-proven NPI capability that makes the MY700 an unbeatable solution for both high-mix and high-speed dispensing applications," says Clemens Jargon, VP Global Dispensing.
"We are extremely proud to be part of Mycronic's unique offering," says Jason Spera, CEO of Aegis Software. "Mycronic and Aegis have a long history of cooperation, going back more than 15 years. It’s with great pleasure we now see this cooperation continued and strengthened for the benefit of our mutual customers."
As part of the agreement, Mycronic will provide an upgrade path for earlier generation machines, enabling MY500 and MY600 users to also benefit from the renewed partnership.
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Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.