-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Dow Highlights Silicone Solutions for Advanced PCB Assembly at productronica 2017
November 20, 2017 | Dow Performance SiliconesEstimated reading time: 2 minutes
At productronica 2017, Dow Performance Silicones, a global business unit of DowDuPont’s Materials Science Division, featured new, proven and upcoming silicone solutions alike under its newly announced DOWSIL brand. Highlights included an early glimpse of a major upcoming product launch; the unveiling and demonstration of a new fast-curing, low-temperature adhesive; and other recent innovations from the company’s broad portfolio of silicone and thermal management solutions for demanding PCB assembly applications.
"Silicone technology has entered a new era of innovation with the launch of the DOWSIL product brand," said Rogier Reinders for Dow. "Replacing the legacy Dow Corning label, the new DOWSIL name represents the combined power of Dow and Dow Corning to push the boundaries of both customer service and material science to pioneer groundbreaking new solutions in the development of advanced materials for PCB and LED assembly."
Dow offered a glimpse of that future during productronica with an exclusive sneak peek of a soon-to-be-launched solvent-free conformal coating that delivers very low viscosity, high hardness and a growing list of external validations for use in demanding PCB assembly applications.
Another highlight at the booth was the DOWSIL EA-6060 Adhesive, which is among the first products to be launched under the new DOWSIL brand. This advanced new silicone bonds quickly at low temperatures to support faster, lower-cost production of electronic modules. DOWSIL EA-6060 Adhesive was also part of a live equipment demonstration, where Scheugenpflug AG, a supplier of adhesive bonding, dispensing and potting technology, dispensed the material live on its CNCell equipped with a Dos GP gear pump dispenser.
Additional innovations displayed at Dow’s booth included the following:
- recently launched DOWSIL EA-5151 Quick-in-Connect (QiC) adhesive, a one-part silicone formulation that delivers fast green strength at room temperature for faster cycle times;
- DOWSIL EG-3810 and EG-3896 Dielectric Gels, designed to withstand higher junction temperatures within IGBT and other power electronics modules, enabling allow higher power densities and, in turn, more compact designs;
- thermally conductive silicones—including the new and exceptionally well-received silicone gap fillers—that deliver outstanding thermal stability to efficiently manage heat dissipation; and,
- conformal silicone coatings that deliver proven protection of printed circuit boards against dust, moisture, harsh chemicals, extreme cycling, and vibration.
About Dow Performance Silicones
Dow Performance Silicones, a business unit of the Dow Consumer Solutions Portfolio aligned to DowDuPont Materials Science, delivers a complete portfolio of silicone solutions and performance materials to serve the diverse needs of customers and industries around the world. From the transportation and pressure sensitive industries to high performance building solutions and chemical manufacturing, Dow’s Performance Silicones business helps our customers solve their most challenging problems. As a global leader in innovation and silicon-based technology, we are committed to bringing new solutions to the market that do more for our customers and continue to improve the lives of consumers worldwide. Visit dowcorning.com to learn more.
About DowDuPont Materials Science Division
DowDuPont Materials Science, a business division of DowDuPont (NYSE: DWDP), combines science and technology knowledge to develop premier materials science solutions that are essential to human progress. The division has one of the strongest and broadest toolkits in the industry, with robust technology, asset integration, scale and competitive capabilities that enable it to address complex global issues. DowDuPont Materials Science’s market-driven, industry-leading portfolio of advanced materials, industrial intermediates, and plastics businesses deliver a broad range of differentiated technology-based products and solutions for customers in high-growth markets such as packaging, infrastructure, and consumer care. DowDuPont intends to separate the Materials Science Division into an independent, publicly traded company. More information can be found at www.dow-dupont.com.
Suggested Items
Oshkosh Defense Advances Next-Gen Autonomous Technology for ROGUE-Fires
01/13/2025 | BUSINESS WIREOshkosh Defense LLC, an Oshkosh Corporation business, was awarded a $29.9 million contract modification to integrate next-generation autonomous technology into the Remotely Operated Ground Unit for Expeditionary Fires (ROGUE-Fires) with deliveries beginning in 2025.
Honda, Renesas Sign Agreement to Develop High-Performance SoC for Software-Defined Vehicles
01/10/2025 | JCN NewswireHonda Motor Co., Ltd. and Renesas Electronics Corporation announced that they have signed an agreement to develop a high-performance system-on-chip (SoC) for software-defined vehicles (SDVs).
Hexagon to Acquire Septentrio; Revolutionizing Positioning in Mission-critical Navigation and Autonomy Applications
01/09/2025 | HexagonHexagon announced an agreement to acquire Septentrio NV, a market leader and OEM provider of Global Navigation Satellite System (GNSS) technologies, to drive innovation and expand the market reach of Resilient Assured Positioning solutions.
Kyocera Participates in TactoTek Funding with €5 Million Investment and Strategic Partnership
01/09/2025 | TactoTekTactoTek, the global leader in In-Mold Structural Electronics (IMSE) technology, announced that Kyocera, a global innovation leader in fine ceramic components, electronics, and technology solutions, has joined TactoTek’s current funding round with an investment of €5 million.
Siemens Launches New Program to Empower Startups with Cutting-edge Technology
01/07/2025 | SiemensSiemens launched Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups.