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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Walt Custer’s Annual Update from productronica 2017
November 21, 2017 | Patty Goldman, I-Connect007Estimated reading time: 6 minutes
Goldman: We like this low, steady growth as opposed to the wild swings, right?
Custer: Yeah. It wouldn't plunge as much but there are other areas, like both semiconductor capital equipment (Figure 5) and PCB process equipment that were at 25–30% growth rates. People either need the equipment or they don't. Then, if suddenly things begin slowing down, those orders can be shut down very quickly.
Goldman: People decide things are growing, so they buy equipment, and then they get it and they are done buying for a while.
Custer: And they want to get in line because they've got to wait a while to get whatever they want. So they place the orders. I'm still a firm believer in watching the really time-sensitive data to see if it changes. So far, it hasn't changed. It's peaked, but it hasn't gone down. We'll keep an eye on it for the next couple of months.
Goldman: That's good to hear.
Custer: If any of your readers want a copy of the presentation I gave at productronica, send an email to walt@custerconsulting.com. It looks at both the world market and the European market.
Goldman: Good to know! Thanks so much for your time, Walt.
Custer: Sure.
Page 3 of 3Suggested Items
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