The 2017 International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show), to be held from December 6–8, 2017 at the Shenzhen Convention & Exhibition Center in Shenzhen, China, will feature leading industry experts sharing their insights on the latest market trends and innovations.
Topics to be discussed include advancing HDI technology, mobile intelligent telecommunications, PCB production for the automotive industry, smart manufacturing for PCB production, cleaning PCB / PCBA flux residual process, and conformal coating trends, among others.
Click here to view the full agenda.