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RTW HKPCA & IPC Show 2017: IPC Asia’s Philip Carmichael on the Changes in PCB Value Chain
December 7, 2017 | Real Time with...HKPCA and IPCEstimated reading time: Less than a minute
During the 2017 International Printed Circuit & APEX South China Fair (HKPCA & IPC Show 2017) in Shenzhen, IPC Asia President Philip S. Carmichael speaks with I-Connect007 Managing Editor Stephen Las Marias about the move in the value chain that’s driving the electronics manufacturing industry forward. He speaks about the new market trends that will further the growth of the PCB industry, as well as how new manufacturing technologies will help bring the industry towards the vision of a lights-out factory.
Finally, Carmichael talks about the need for knowledge transfer, education, and standards, in the industry.
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