-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Amerway Exhibiting High Purity Solder Products at IPC APEX EXPO 2018
December 12, 2017 | Amerway Inc.Estimated reading time: 1 minute

Amerway Inc. will be exhibiting a full range of premium solder products including solder bar, wire, fluxes, and custom alloys at IPC APEX EXPO 2018, which will be held at the San Diego Convention Center on February 27–March 1, 2018. Amerway will be in Booth 2502.
Amerway provides the SMT industry with a wide range of solder products from solder bar to solder paste, wire, and more. In addition to their own premium products, Amerway offers Balver Zinn Cobar Solder Products including the well-known lead-free SN100C family of alloys.
Amerway offers customers a 'cradle to grave' solution ranging from new alloys to metals waste recycling in partnership with Conecsus LLC, an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues.
In making the announcement, Terry Buck, president, said, "Amerway, recently awarded ISO 9001 quality certification, is pleased to offer Balver Zinn Cobar SN100C in addition to our own Amerway product line. Our full range of soldering solutions, in addition to waste recycling programs with partner Conecsus, will be available in our booth at APEX next year."
Balver Zinn Cobar SN100C is a nickel-stabilized tin copper eutectic, containing a small amount of germanium to reduce oxidation. SN100C generates bright and shiny solder joints, comparable with lead-containing solders. In 2005, NASA tests indicated that SN100C is the most reliable soft solder for wave soldering. SN100C is especially preferred for the higher process temperatures of selective soldering.
About Amerway
Amerway Inc., based in Altoona, Pennsylvania, is a premier supplier of solder bar, solder wire, fluxes, and custom alloy products to the electronics manufacturing industry. Amerway manufactures a large selection of lead free alloys including pure tin, tin/copper, tin/antimony, tin/silver, SAC-alloys, fluxes, and more. Amerway Inc. has been recently awarded ISO 9001 quality certification, and now offers high-quality and high-purity Balver Zinn Cobar solder products including Fluxes, Solder Paste, and Solder Wire, and SN100C lead-free alloys. For more information, click here.
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.