Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Improving Solder Paste Printing
December 12, 2017 | Stephen Las Marias, I-Connect007Estimated reading time: 1 minute
In my recent conversation with process engineers at an EMS company here in the Philippines, they said one of the critical processes that determine yield in their line is the solder paste printing process. According to them, one of the key reasons for this is the incorrect printer set-up, which results in issues such as insufficient solder or solder bridging. Of the three elements involved in the process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.
Indeed, in our latest survey on solder paste printing, a majority of the respondents highlighted stencils as one of their key challenges. They mentioned the quality of the stencils; getting the right stencils—their stencils are done by a third party; aperture design; and stencil wear, among others, as issues around this part of the process. This is made more challenging because of the finer pitch and spacing in PCB designs. Specific problems in this regard include complete filling of apertures, paste release, and the large range of component types and sizes and the solder paste thickness requirement on the same design.
Other main issues include the accuracy and repeatability of the equipment, and the characteristics of the solder pastes being used.
Which brings me to our topic for this month’s issue of SMT Magazine. Many studies over the years have found that up to 70% of PCB assembly defects come from the solder paste printing operation. In this issue, we look at the critical issues in the solder paste printing process, and how assemblers can address these challenges to help improve their yield and quality.
To read the full version of this article, which appeared in the December 2017 issue of SMT Magazine, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.