Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Alpha to Showcase Die Attach and SMT Solutions at Internepcon Japan 2018
December 14, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the 2018 Internepcon Japan show to be held in Tokyo from January 17-19, 2018.
At the show, Alpha, a part of the MacDermid Performance Solutions group of business, will be exhibiting its latest range of products for SMT assembly Solutions, die attach assembly solutions and industrial assembly solutions. The products include Agromax, Atrox, High Temperature Dipping Alloys, Low Melting Point Solder Paste, Assembly Polymers, Innolot Alloys, PowerBond and AccuFlux.
In addition, Alpha will showcase its newly developed solution for void reduction under bottom terminated components (BTC), the ALPHA AccuFlux BTC-578 Preform System. The system combines ALPHA AccuFlux BTC-578 Preform, solder paste, engineered stencil designs and optimized processing parameters to dramatically and consistently decrease voiding.
For more information on Alpha's latest product technologies, visit Alpha Assembly Solutions Booth at Internepcon Japan Hall East 5-4.
About 47th Internepcon Japan
Internepcon Japan is the world’s leading SMT exhibition gathering Equipment, Solutions and Services for Electronics Manufacturing. For more information, click here.
Date: Wednesday 17th – Friday 19th January 2018 (10:00-18:00, Last Day until 17:00)
Venue: Tokyo Big Sight, Japan
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.