Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
TUC Breaks Ground for New Advanced Technology Center
January 7, 2018 | TUCEstimated reading time: 1 minute
George Hsin, chief strategy officer of Taiwan Union Technology Corporation (TUC) is pleased to announce that TUC broke ground for a new Advanced Technology Center adjacent to the current headquarters and manufacturing site in Hsinchu, Taiwan. TUC plans an investment of NT$1.6 billion (US$ 53.3 million) for 24,500 square meter facility for R & D as well as state of the art manufacturing. The 5th of December 2017 ceremony was attended by state and local government officials as well as the management team of TUC.
TUC plans to produce base materials for microwave, antennae, radio frequency as well as IC substrates. The added capacity is expected to produce roughly 200,000 sheets (2.5 million square feet) of copper-clad laminates per month.
TUC has just completed their new analytical laboratory complex with an investment of NT$15 million (US$500,000). The temperature- and humidity-controlled cleanrooms have been completed which include state-of-the-art test equipment. Some of the new instruments include equipment for testing up to 67 GHz for Dk and Df, a 500 volt CAF analyzer with 400 channels, DSC/TGA/DMA thermal analysis apparatus, rheometers, electronic microscopes with X-ray fluorescence, gas and liquid chromatography units, infrared analysis and microsection equipment.
From left to right: Jiang Cheng Wu (GM Xuan-Tong System Integration, Ching He Lin ( GM Wei Shuen Construction), CT Lin (TUC Consultant), CN Chen (GM TUC), CH Hsin (Chairman TUC), George Hsin (Chief Strategy Officer TUC), Kuan Liang Lee (GM, EVERGREEN STEEL), CW Chu (GM Zhu Zhiwen Architects)
About TUC
TUC is a leading global developer and manufacturer of prepregs and laminates for the electronics industry. We work relentlessly to provide materials that deliver solutions for present and future designs by partnering with our customers, as well as market-leading OEM’s. With this partnership, we are able to offer outstanding value with unparalleled service and support.
TUC is committed to innovation and leading technologies while maintaining product manufacturability. Our products deliver excellent resistance to moisture and chemicals as well as industry leading anti-CAF and CTE properties. We provide superior global technical resources and a competitive edge to equip customers with solutions that generate extraordinary value.
Please visit the TUC website here.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.