-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Committee Revises DSC Test Method for Tg
January 9, 2018 | IPCEstimated reading time: 1 minute
IPC’s 3-11 Laminate/Prepreg Materials Subcommittee has announced the publication of the latest revision of the test method for the determination of glass transition temperature (Tg) of copper-clad laminates (CCL). IPC-TM-650 Method 2.4.25 utilizes Differential Scanning Calorimetry (DSC) to measure the Tg of the base materials for rigid printed circuit boards. The Tg is one of the characteristics used to estimate the thermal reliability of materials used in electronics.
The key change in the document clarifies what is and what is not a phase transition as the temperature approaches the Tg for the first time. In the past, the unusual exotherms or endotherms could be interpreted as being a Tg. There are a number of reasons cited for these spurious events including stress relief, release of moisture and evaporation of residual solvent. The Pre-Scan step is needed to make the baseline more stable for the calculation of Tg1 and Tg2. The Pre-Scan takes the temperature to about 10°C above the predicted Tg1, then the sample is cooled immediately back to the starting point temperature. The determination of Tg1 is then carried out by a second scan which terminates at either 175°C or 190°C depending of the type of epoxy resin system. At the termination temperature, the specimen is held at isothermal conditions for 15 minutes before cooling again to the starting point temperature. Finally, a third scan is conducted to determine Tg2. It is Tg1 and Tg2 that are used to calculate either the cure factor or the delta Tg.
All of the IPC-TM-650 test methods can be found free of charge at the IPC website, www.IPC.org under the “Knowledge” tab.
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.