Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
Global Sourcing Spotlight: The New Landscape of Manufacturing 
Nolan’s Notes: Five Key Changes to APEX EXPO
IPC E-Textiles Standards Committee Seeks Comments on Draft of New E-Textiles Standard
January 10, 2018 | IPCEstimated reading time: 1 minute
The IPC E-Textiles Materials Subcommittee is collecting comments on the first sections of IPC-4931, requirements for electronic textiles (E-Textiles), conductive fibers and conductive yarns. This standard will establish the classification system, qualification and quality conformance requirements and electrical/electronic performance requirements for electronically integrated textiles (e-textiles). It also covers similar requirements and performance variables for conductive fibers and conductive yarns, that are essential components of e-textiles.
E-textiles included in this standard:
- Woven textiles
- Knitted textiles
- Nonwoven textiles
- Laminated textiles
- Braided textiles
- Embroidered textiles
- Printed textiles
The subcommittee specifically seeks comments on the first sections of the standard. These sections are important because they lay out the specific types of textiles and their components that the standard will cover. Additionally, the group wants industry input on the key performance characteristics the standard should include for these materials as well as the industry test methods that should be used to test for these characteristics.
The subcommittee is collecting comments through Friday, February 16, and commenting is open to anyone. You do not need to be a member of IPC or to pay any fees to review and comment.
Subcommittee Meeting to Discuss Comments
You are invited to attend the IPC D-72 E-Textiles Materials Subcommittee meeting, which will take place Thursday, March 1 during IPC APEX EXPO in San Diego. The specific start and end times for the meeting have not been set yet, but plan on a full-day session.
New Subcommittee Forming to Develop Guideline for E-Textiles Connectors
Several companies in the e-textiles industry have approached IPC with interest in developing a guideline on e-textiles connections. This is a very new activity, but based on interest, IPC should be forming a subcommittee to break ground on this new document in early 2018. If you have interest in this topic and would like to join the subcommittee roster, e-mail me at ChrisJorgensen@ipc.org.
Mark Your Calendar for IPC E-Textiles 2018
Mark your calendar for September 13, 2018. IPC E-Textiles 2018 will bring together the e-textiles supply chain for a full day of technical presentations, hands-on product demonstrations and networking. Don’t miss this opportunity to learn from and interact with innovators from the e-textiles community. Plan to arrive a day early for standards meetings on September 12.
For more information, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
02/12/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
EMS Leadership Summit: A Smarter Way to Gather EMS Leaders
02/11/2026 | Nolan Johnson, SMT007 MagazineMark Wolfe is a career EMS and electronics expert, whose leadership has helped expand and improve the EMS Leadership Summit at APEX EXPO. Last year’s event received a huge approval rating from attendees: a whopping 96% said they’d be back. Not content to rest on those laurels, Mark and his team have put together a program that preserves the Summit’s strengths while finding ways to improve. In this interview, Mark makes a strong argument why EMS leadership at all levels should take a day to examine the wider picture of our industry.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Global Chips Market Hitting Record High Sales Figures in 2025
02/09/2026 | ESIAThe European Semiconductors Industry Association (ESIA) announced that global semiconductor sales reached US$ 791.69 billion in 2025, which means a marked 26.1% increase on a year-on-year basis. Semiconductor sales in the Europe reached US$ 54.46 billion in 2025, a 6.2% rise versus 2024.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/06/2026 | Nolan Johnson, I-Connect007Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.