-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Omron Enables High-Speed X-ray Inspection of BGAs, LGAs and Connectors
January 10, 2018 | OmronEstimated reading time: 2 minutes
Omron's VT-X750 automatic X-ray inspection system incorporates the latest solution for manufacturers desiring high quality, in-line, automated X-ray inspection on PCBs, containing components such as BGAs or LGAs and through-hole connectors.
Traditional X-ray technologies are limited in inspecting components like BGAs, LGAs or THT-components. Omron's VT-X750 incorporates 'Computed Tomography' (CT), specifically to provide high-precision, X-ray imaging to perform precise and reliable analysis of these hidden soldered areas.
"The VT-X750 can inspect accurately and reliably, soldered defects such as Head in Pillow and voids within BGA and LGA devices," explains Kevin Youngs, Key Account Manager Europe at Omron Automated Inspection Business Europe. The new inspection system measures also the percentage solder, including voids in QFN's, and Barrel Fill in through-hole devices.
Traditional AXI systems incorporate 2D or 2.5D X-ray tomography. But these technologies provide limited capability causing high false calls and are insufficient to find core defects such as Head in Pillow and in many cases, voids. The limitation of these systems is the capability to inspect PCB’s with double sided components. 3D-AXI overcomes these deficiencies of traditional 2D or 2.5D system. However, in today’s AXI systems, there are 2 basic forms of 3D X-ray: Tomosynthesis and Computed Tomography.
The VT-X750 inspections are performed very quickly at speeds less than 4 msec per field-of-view (FOV). Omron strongly believe combining VT-X750 new ultra-fast process times and unique data capturing technology, VT-X750 is the first 3D-CT AXI system that can be utilised into the SMT production Line.
"We see this as a great benefit targeted to increase customer manufacturing quality and reduce manufacturing costs," says Youngs. In comparison to Tomosynthesis, VT-X750 utilises CT reconstruction software and combines multi-slice data with laser displacement technology that gauges the PCB surface for each solder-joint, for example each solder ball of BGA, compensating for any warpage and allowing the system to perform cross-sectional analysis at the proper slice-level locations.
Selectable inspection of 6, 8, 10, 15, 20, 25 or 30 microns combined with selectable numbers out of 512 X-ray projections up to 512, taken from different angles to produce cross sectional tomographic images of specific areas of target area, allow for user-driven variation between higher inspection speeds for production environments, and ultra-high-quality 3D image acquisition for research of defect analysis.
"The machine offers benefits for a big group of customers, from automotive suppliers , with high running production lines to midsize companies who need an X-ray also for smaller batches," says Youngs.
Omron incorporates CT as VT-X750 principle inspection criterion.
"The key factor was to develop 3D X-ray technology that addresses the limitations of other 2.5D and other 3D X-ray technologies, thus providing the highest quality solder joint inspection for key industries such as automotive, aerospace, infrastructure, communication and medical," explains Youngs.
About Omron
Omron is a world leading company providing innovation and solutions for manufacturing. More and more factories are using intelligent sensing devises and control technologies to ensure manufacturing quality, and robots for product conveyance and picking. Movements towards IoT are spreading quickly in the manufacturing field and furthermore, the improvement of AI skills is accelerating the discovery of production beyond the ability of humans. Omron is the global leader of Automated Optical Inspection systems, with over 30 years of experience in Tier 1 manufacturing companies, utilising its core technologies to the benefit of global electronic manufacturing sector.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.