-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Corporation Announces New Corporate Leadership
January 11, 2018 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving as the Chairman of the Board.
Evans has been with Indium for 36 years. He began as a technical support engineer and quickly rose to product line manager, helping expand the company’s product lines into the SMT assembly field. As division director for Indium's electronics assembly materials, he guided the steady growth of the solder paste product line and instituted a formal corporate R&D function. Evans eventually became the VP of manufacturing and sales, overseeing the expansion of the company's manufacturing footprint and sales structure in the UK, Singapore, China, South Korea, and Malaysia, and addressing the growing global demand for Indium products. Evans was named president and COO in 1997, leading the company’s growth from dozens of people to over 800 and from one factory in Utica, New York to 12 facilities, worldwide. Under his leadership, Indium has earned numerous awards, honors, and recognition due to the strengthening of corporate culture and performance.
Evans earned his AAS in Engineering Science from Mohawk Valley Community College, his BS in Chemical Engineering from Clarkson University, and his MBA from Rensselaer Polytechnic Institute.
“Greg’s leadership has propelled Indium Corporation to the position of more than just an electronics assembly materials manufacturer and supplier of choice, but also an employer of choice,” Macartney III said. “I very much look forward to continuing our close work together as we spend many more years dedicated to the success of Indium Corporation and strengthening the company. Together, we are equally dedicated to the success of each member of the Indium Corporation family, and will work to secure our futures, achieve everyone’s potential, and uphold our company culture – The Indium Way.”
As CEO, Evans will focus, primarily, on the company’s long-term mission and strategies. His work will ensure the ongoing growth and vibrancy of Indium.
Berntson joined Indium in 1996 as a product specialist. He quickly rose to the roles of product manager, marketing leader, sales leader, tech support leader, and, most recently, as executive vice president. Berntson is an active member of numerous industry organizations, including IPC, iNEMI, IMAPS, and SMTA. He has published several technical papers and articles, and presented at technical conferences globally. Berntson has a master’s degree in business administration and a bachelor’s degree in chemistry from Cornell University, where he earned the Henny Wittink Memorial Marketing Prize and the George Caldwell Award.
“Over the past 20 years, Ross has been intelligent and strategic in his results-driven approach to leadership at Indium Corporation,” Evans said. “I look forward to continuing to work alongside Ross as we further secure Indium Corporation’s position as the global leader in quality electronics assembly materials and technical support.”
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.