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IPC North American EMS and PCB Statistical Programs Open
January 12, 2018 | IPCEstimated reading time: 1 minute
IPC’s statistical programs for the rigid printed circuit board, flexible circuit and contract electronics manufacturing industries in North America are now open to new participants for 2018. The deadline for IPC members to sign up is February 2. Participation is free to IPC-member companies as a benefit of membership.
The statistical programs give participating IPC members access to timely market and management data that would be impossible for them to collect themselves and prohibitively expensive for individual companies to obtain from research firms. As a neutral and trusted third party, IPC collects sales, orders and other business data from the participating companies using a secure and confidential online survey system. In exchange, these companies receive the aggregate data monthly and comprehensive quarterly reports that reveal the latest market and management trends for the industry.
Participating companies use the data in their marketing, sales, planning and financial activities. It helps them to track changes in their market shares, compare their business performance against industry averages in their size tiers and product segments, and identify growing and declining markets.
These statistical programs have been running for decades. Participants are both public and private companies of all sizes, including many of the region’s leading PCB and EMS companies.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
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