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PACE to Launch Low-Cost Soldering Station at IPC APEX EXPO 2018
January 12, 2018 | PACE WorldwideEstimated reading time: 1 minute
PACE Worldwide announces the ADS200, a new high-power, low-cost production soldering station, to be introduced at IPC APEX EXPO 2018, which will be held on February 27-March 1, 2018 at the San Diego Convention Center. The ADS200 features the new TD-200 Cool-Touch Handpiece, with its sleek and ergonomic aluminum handle designed to stay cool and comfortable during continuous production soldering. Its Blue Series Tip-Heater Cartridges integrate a high-accuracy sensor with a robust heater, delivering up to 120W of power. The quick-change cartridges can be quickly swapped while hot, and achieve set temperatures instantly. Yet, the tip cartridges are less than half the price of most other cartridge style or curie point tips.
PACE's new AccuDrive temperature control technology delivers unsurpassed thermal performance and highly accurate temperatures, without the need to change tip cartridges or calibrate. Its advanced electronics provide instantaneous load sensing and on-demand power to quickly reflow solder joints at the lowest, safest temperature required, regardless of the mass of the application. Intended for extreme, multi-shift production use, the ADS200 features a rugged, all-metal design, including housing, soldering iron and tool stand. The system is intuitive and easy to operate – just power it on, set the temperature with arrow keys and start soldering.
About PACE
PACE Worldwide has been providing the most innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Since the dawn of the modern electronics industry, PACE has played a key role in the development of groundbreaking products, training films, curricula, materials and electronic assembly standards, including several soldering, surface mount and through-hole rework videos co-produced with the IPC and industry.
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Julia McCaffrey - NCAB GroupSuggested Items
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Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.