Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
PACE to Launch Low-Cost Soldering Station at IPC APEX EXPO 2018
January 12, 2018 | PACE WorldwideEstimated reading time: 1 minute
PACE Worldwide announces the ADS200, a new high-power, low-cost production soldering station, to be introduced at IPC APEX EXPO 2018, which will be held on February 27-March 1, 2018 at the San Diego Convention Center. The ADS200 features the new TD-200 Cool-Touch Handpiece, with its sleek and ergonomic aluminum handle designed to stay cool and comfortable during continuous production soldering. Its Blue Series Tip-Heater Cartridges integrate a high-accuracy sensor with a robust heater, delivering up to 120W of power. The quick-change cartridges can be quickly swapped while hot, and achieve set temperatures instantly. Yet, the tip cartridges are less than half the price of most other cartridge style or curie point tips.
PACE's new AccuDrive temperature control technology delivers unsurpassed thermal performance and highly accurate temperatures, without the need to change tip cartridges or calibrate. Its advanced electronics provide instantaneous load sensing and on-demand power to quickly reflow solder joints at the lowest, safest temperature required, regardless of the mass of the application. Intended for extreme, multi-shift production use, the ADS200 features a rugged, all-metal design, including housing, soldering iron and tool stand. The system is intuitive and easy to operate – just power it on, set the temperature with arrow keys and start soldering.
About PACE
PACE Worldwide has been providing the most innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Since the dawn of the modern electronics industry, PACE has played a key role in the development of groundbreaking products, training films, curricula, materials and electronic assembly standards, including several soldering, surface mount and through-hole rework videos co-produced with the IPC and industry.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.