The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
AIM’s Dr. Mehran Maalekian to Present at IPC APEX 2018
January 15, 2018 | AIM SolderEstimated reading time: 2 minutes
AIM Solder is pleased to announce that Dr. Mehran Maalekian, Research & Development Director, will present at the IPC APEX EXPO 2018 taking place February 27 – March 1, 2018 at the San Diego Convention Center in San Diego, California.
Dr. Maalekian will share his extensive knowledge of and review the industry needs for solder alloys that can execute effectively in harsh service conditions and examines potential solutions for failed or flawed applications. With the extensive adoption of Sn-Ag-Cu (SAC) alloy as the de facto lead-free solder standard, the limitations of this alloy and its family are more clearly revealed. Specifically, SAC305 has shown poor creep resistance in harsh service environments. If aged or exposed to high service temperatures SAC305 undergoes substantial microstructure evolution leading to degradation of mechanical strength of the solder joint. In this work, effects of thermal aging and silver content on mechanical performance, intermetallic growth rate and reliability of SAC alloys are reviewed. Then, a lead-free solder alloy is introduced that exhibits superior performance for demanding applications. The new alloy, with higher strength and stable creep properties shows superior thermal fatigue resistance compared with SAC305. It is demonstrated that the new lead-free high reliability alloy can be a good solution for harsh environment electronics applications.
About Dr. Maalekian
Dr. Maalekian is experienced in materials engineering with a focus on physical metallurgy, soldering, modeling in materials engineering, metal forming and thermo-mechanical processes. Dr. Maalekian has received numerous recognitions including the National Sciences and Engineering Research Council of Canada Award, the International Henry Granjon Prize (IIW), and IWS-Sossenheimer Award. He has been awarded the honor of Speaker of Distinction by the Surface Mount Technology Association (SMTA). Dr. Maalekian has published many scientific and technical papers, serves as a reviewer of several scientific journals, and is on the editorial board of “Science and Technology of Welding and Joining.”
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.