Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Alpha Assembly Solutions to Feature Void Reduction, Low-Temp Tech at IPC APEX EXPO 2018
January 18, 2018 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will feature its latest low temperature solder and void reduction solutions technologies at the upcoming IPC APEX EXPO 2018 trade show in San Diego, California. Alpha will be at Booth 727.
Alpha's recently launched low temperature solder paste, ALPHA OM-550, will be the focus among its Low Temperature Solder Solutions. "OM-550 provides another low temperature solution to customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy," said Robert Wallace, Regional Marketing Manager for the Americas. "This is a first rate paste that provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability compared to other low temp alloys."
Alpha's void reduction solutions technology combines several of Alpha’s innovative products and assembly processes. "Alpha has developed a reliable low void technology system for bottom terminated components which has shown to dramatically decrease voiding," said Jerry Sidone, Product Manager for Engineered Materials at Alpha Assembly Solutions. "We will discuss this technology and provide data that addresses the challenges of voiding and managing thermal reliability in the paper presentation, Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat."
The paper will be delivered on Tuesday, February 27 at the Bottom Terminated Components Session from 1:30–3:00 pm.
Alpha will be co-exhibiting in Booth #727 with MacDermid Enthone Electronics Solutions. Both companies are a part of the MacDermid Performance Solutions group of businesses. Please visit us there.
About MacDermid Performance Solutions
MacDermid Performance Solutions Business group of businesses supply innovative, functional products to a rapidly changing electronics marketplace. We research, develop and deliver specialty substrates and high performance environmental friendly materials that enable the manufacture of complex electronic circuits and assemblies. For more information, visit http://www.macdermid.com/.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.