Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
TRI to Feature Revolutionary AOI at IPC APEX EXPO 2018
January 22, 2018 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI) will join IPC APEX EXPO 2018 held at San Diego Convention Center on February 27th - March 1st featuring innovative one-stop inspection solution for Industry 4.0-based PCBA manufacturing. Visit booth #1317 to see TRI's all new 3D SPI, 3D AOI, 3D Planar CT AXI and ICT solutions in action and discuss your inspection requirements with TRI's experts.
Planar CT X-Ray
Planar Computed Tomography (CT) X-Ray inspects effectively PCBAs layer by layer without in not invasive way achieving unbeatable inspection depth. Recommended for the inspection of solder volume, double-sided multilayer-boards and defects such as head-in-pillow.
TRI's VP of Sales and Marketing Jim Lin commented on the occasion, "We are honored to announce TRI’s innovative Depth from Focus 3D AOI technology. TRI’s cutting-edge TR7700Q DFF 3D AOI guarantees 1µm ultra-high resolution and 01005in chips. We are eager to share TRI’s innovations with our partners and the rest of the SMT Industry.”
TRI is eager to showcase the revolutionary TR7700Q 3D AOI with Depth from Focus (DFF) module and stop-and-go technology to optimize the inspection of complex PCBs, delivering high speed, high accuracy and high reliability testing.
Depth from Focus
Depth of Focus (DFF) is a revolutionary 3D sensing technique that searches for the optimal focus position and measures the depth of the image. The DFF algorithm will create 3D model of the component and its surroundings.
TRI’s portfolio for IPC APEX EXPO 2018 will include the Global Technology Award-winning TR7007QI 3D SPI, along with market leading 2D + 3D AOI solution TR7500QE. Both systems deliver industry leading performance based on CoaXPress Imaging Technology. TRI will showcase its hallmark inline PCBA inspection solution, the TR7600 SIII series CT AXI, including TR7600 SIII and TR7600F3D. Built with planar CT and high density boards in mind allows the TR7600 SIII series models to rapidly deliver very clear 3D X-ray images using high speed cameras with advanced image processing.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more here.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.