-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Advanced Reflow, Selective Solder and Rework Systems from Ersa at APEX
January 24, 2018 | ErsaEstimated reading time: 1 minute

Kurtz Ersa North America today announced plans to exhibit in Booth #1337 at the 2018 IPC APEX EXPO, scheduled to take place February 27 - March 1, 2018 at the San Diego Convention Center in Califronia. The Ersa team will highlight a lineup of advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, VERSAFLEX-Ultra selective solder module and IR/PL 650 XL rework system.
The VERSAPRINT 2 Ultra is the first stencil printer worldwide with fully integrated 100 percent 3D SPI. Advantages vs. 3D SPI standalone systems include:
- 3D SPI for the inspection of complex PCBs directly after the printing process
- VERSAPRINT stencil inspection detects errors before they appear
- Zero reference measurement of the unprinted PCB can be performed before every print
- Integrated closed-loop function for print offset compensation
- One software platform for print inspection – one consistent operator concept
- Maintenance and service for only one machine
- One contact for both processes
- Less space required on the shop floor
The VERSAFLEX-Ultra selective solder module offers unlimited flexibility, productivity and uncompromising quality – two solder pots, either y- and x-variable or z-variable, equipped with different solder and different solder nozzles, can work in parallel.
With its revolutionary flexibility, the soldering pots move freely in x-, y- and z-direction. Each soldering pot is completely independent and has no y- or x-dependencies to the other one. An anti-collision software ensures the free movement of the servo-driven axis system of the soldering pots.
The IR/PL 650 XL is Ersa‘s flagship machine for extra large printed circuit boards (PCBs). PCBs up to 20 x 24" or 500 x 625 mm can now be safely and rapidly reworked using one of the industry's largest and most powerful bottom-side heaters – an 8,000 W medium wavelength IR heater measuring 500 x 625 mm.
For more information about Kurtz Ersa North America, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.