Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Electrolube Launches Non-Silicone Zinc Oxide-Free Thermal Paste
January 25, 2018 | ElectrolubeEstimated reading time: 1 minute
Electrolube's new Non-Silicone Heat Transfer Compound, HTCX_ZF, is an entirely zinc oxide-free version of one of the company's best-selling thermal products, HTCX, with the additional benefits of improved thermal conductivity, lower oil bleed and lower evaporation weight loss.
Designed for use as a thermal interface material, the high performance paste HTCX_ZF is ideal for applications where the use of zinc oxide (ZnO), a marine pollutant, is restricted and silicones are prohibited, such as offshore utilities for instance. The new RoHS2-compliant thermal paste is also highly suitable for applications exposed to varying temperature and humidity conditions.
HTCX_ZF is a highly stable, non-curing paste, which enables simple and efficient rework of components if needed and is recommended where efficient and reliable thermal coupling of electrical and electronic components is required, and between any surface where thermal conductivity and heat dissipation is important. It offers efficient thermal conductivity of 1.65 W/m.K for a range of applications, remaining stable and keeping a low oil bleed percentage through a wide operating temperature range from -50°C to +180°C and potentially higher, depending on the application and testing in relevant end-use conditions.
HTCX_ZF can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40–60% of the interface, depending on the smoothness of the surfaces. This means that air, which has relatively poor thermal conductivity, will account for the balance of the interface. Only a small amount of HTCX_ZF is required to fill these spaces to dramatically increase the effective surface area for heat transfer. HTCX_ZF is also easy to apply, ensuring the best results are achieved with a uniform, thin coat applied between mating surfaces.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Peters Spotlights Heatsink Paste at productronica
10/22/2025 | PetersThe ELPEPCB HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.
Indium Expert to Present on Advancing Thermal Performance at TestConX China
10/21/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).