-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Electrolube Launches Non-Silicone Zinc Oxide-Free Thermal Paste
January 25, 2018 | ElectrolubeEstimated reading time: 1 minute

Electrolube's new Non-Silicone Heat Transfer Compound, HTCX_ZF, is an entirely zinc oxide-free version of one of the company's best-selling thermal products, HTCX, with the additional benefits of improved thermal conductivity, lower oil bleed and lower evaporation weight loss.
Designed for use as a thermal interface material, the high performance paste HTCX_ZF is ideal for applications where the use of zinc oxide (ZnO), a marine pollutant, is restricted and silicones are prohibited, such as offshore utilities for instance. The new RoHS2-compliant thermal paste is also highly suitable for applications exposed to varying temperature and humidity conditions.
HTCX_ZF is a highly stable, non-curing paste, which enables simple and efficient rework of components if needed and is recommended where efficient and reliable thermal coupling of electrical and electronic components is required, and between any surface where thermal conductivity and heat dissipation is important. It offers efficient thermal conductivity of 1.65 W/m.K for a range of applications, remaining stable and keeping a low oil bleed percentage through a wide operating temperature range from -50°C to +180°C and potentially higher, depending on the application and testing in relevant end-use conditions.
HTCX_ZF can be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40–60% of the interface, depending on the smoothness of the surfaces. This means that air, which has relatively poor thermal conductivity, will account for the balance of the interface. Only a small amount of HTCX_ZF is required to fill these spaces to dramatically increase the effective surface area for heat transfer. HTCX_ZF is also easy to apply, ensuring the best results are achieved with a uniform, thin coat applied between mating surfaces.
Suggested Items
Eco-Scouts Initiative: Rehm Apprentice Team Receives Jury Award
07/04/2025 | Rehm Thermal SystemsAt the end of May, as part of this year’s ECO-Scouts Initiative, 14 interdisciplinary apprentice teams from various companies presented their project results to a panel of experts.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Ventec Strengthens Commitment to Halogen-Free PCB Manufacturing in Europe
06/11/2025 | Ventec International GroupVentec International Group, the PCB materials innovator, manufacturer, supplier and one-stop shop for copper clad laminates, prepregs, as well as process consumables and PCB manufacturing equipment has established volume inventory of halogen-free FR4.1 and FR15.1 PCB materials at its European hub in Germany.
GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves
06/09/2025 | Gen3GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.