Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
CyberOptics to Demo New 3D AOI, SPI and CMM Systems at IPC APEX EXPO
January 26, 2018 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics Corporation announced plans to exhibit in Booth #2409 at the 2018 IPC APEX EXPO, scheduled to take place February 27 - March 1, 2018 at the San Diego Convention Center, California. Company representatives will demonstrate the new high-speed SQ30003D CMM, an extension of the MRS-enabled SQ3000 platform deemed best-in-class, the new SE3000 SPI system and QX250i double-sided AOI system.
The new SQ3000 3D CMM (Coordinate Measurement) system, powered by Multi-Reflection Suppression (MRS) technology utilizes CyberCMM, a new comprehensive software suite for coordinate measurement. In a lab or production environment, the MRS-enabled SQ3000 CMM system is extremely fast and highly accurate, with repeatable and reproducible measurements for metrology applications in manufacturing of a wide variety of products such as PCBs, semiconductors and consumer electronics.
CyberCMM, an extensive suite of CMM tools, provides 100 percent metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y, to name a few. A fast and easy setup can be performed as compared to a slow, engineering resource-intensive setup that typically requires multiple adjustments with traditional CMMs.
The new SE3000 SPI system is the very first SPI system to incorporate the industry-leading MRS sensor technology with a finer resolution for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits. Combined with the award-winning, easy-to-use software, solder paste inspection has reached a new level of precision for the most stringent requirements.
Also on display, the QX250i simultaneous double-sided AOI system offers fast, flexible and high performance inspection for all applications, and is ideally suited for pre-reflow and selective solder inspection. The top and bottom high-resolution Strobed Inspection Modules (SIMs) with enhanced illumination provide a single platform for the inspection and defect review process that shortens the production line and drives approximately 50 percent productivity improvement.
About CyberOptics
CyberOptics Corporation is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
For more information, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.